The new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures better yields for MEMS devices built on larger wafers.
Also read: Keysight Unveils 3kV High Voltage Wafer Test System
Transitioning to 300-mm Wafers in MEMS Manufacturing
MEMS manufacturers have begun to transition from 200-mm to 300-mm production lines to achieve economies of scale and meet growing market demand for MEMS devices.
However, migrating to 300-mm wafers requires significantly higher bond forces compared to 200-mm wafers to ensure the same bond pressure over a much larger surface area.
Key Features of the GEMINI Platform
GEMINI platform features an integrated modular HVM system for aligned wafer bonding.
It also includes fully automated optical alignment, full flexibility with customisable module configurations, and support for a wide range of bonding processes.
EV Group’s Role in Advancing MEMS Technology
"EV Group has more than 30 years of experience providing production wafer bonding systems for the MEMS industry. Working closely with our customers and partners, we can see key trends and inflection points in this market very early on, and plan accordingly," stated Dr. Thomas Glinsner, corporate technology director at EV Group.
Innovative Wafer Bonder for MEMS Manufacturers
"Our next-generation GEMINI wafer bonding system is a prime example of EV Group putting our long-term vision and experience into action. The result is the first wafer bonder of its kind for the MEMS industry, which helps our customers to stay on their technology roadmaps and bring innovative and exciting new MEMS devices and end-products to market."
