The tool will be used to support the growth of advanced heterogenous packaging for artificial intelligence chips to enable LLMs.
The TersOnus TGV system is being used for production of advanced 2.5D and 3D packages by semiconductor manufacturers. YES has developed the equipment and process technologies required for high aspect ratio through glass vias for a variety of glass types, as well as for manufacturing a diversity of glass via configurations—such as hourglass, straight, and tapered vias—by leveraging different chemistries. Furthermore, these sub-50 µm vias can be created with various aspect ratios while meeting customers specifications.
Michael Daly, SVP of Wet BU at YES said, "To accommodate performance requirements of new emerging applications, semiconductor solutions are moving to a chiplet-based architecture that has higher interface bandwidth, larger memory and more heat dissipation. It also requires larger substrate sizes at the same time."
"These large substrate sizes are not economically possible with traditional organics materials. The semiconductor industry is moving to glass-based substrates for these leading-edge applications. Our Wet process tools for creating TGVs for glass panels are fully automated and can handle multiple panels simultaneously. In addition, our tools offer integrated in-line metrology for process control and maintaining consistent etch performance," Daly added.
Rezwan Lateef, President of YES said, "YES has maintained its leadership position in the advanced packaging market segment by enabling customer roadmaps through the delivery of superior products with low cost-of-ownership and high reliability. The TersOnus TGV delivers on this commitment by providing excellent etch rates and aspect ratios for the most challenging through glass vias all the while reducing manufacturing cycle times.
"The TersOnus TGV is just one of many products that YES has introduced and will be introducing to the burgeoning glass panel market to support AI advancement."
