Techsil Ltd

Techsil’s Top 10 Thermal Management Materials

Technology Spotlights

Demand for Thermal Interface Materials (TIMs) is growing fast. As electronic devices get smaller with higher energy density and increasing operating temperatures cooling is essential to prolong service life of these devices. Techsil’s TIM pastes offer efficient heat transfer to the heat sink and also thermal stress resistance.

Along with good thermal conductivity; bond line thickness and surface contact are also important factors in thermal management. Techsil’s TIM adhesives are offered both as air cured and heat cured and are available in a range of viscosities, thermal ratings and a variety of pack sizes from syringes, tubes, cartridges and pails to aid consistent dispensing.

Here are Techsil’s Top Ten most popular TIM products and their features and benefits

1. Momentive TIS420C Gap Filler

  • Thermal conductivity 4.2W/mK
  • 1-part non-flowable, repairable silicone paste
  • Room temperature curing
  • Pillow cure, dry on the outside & soft on the inside
  • 30 minutes tack free time
  • Gives stress relief & pump out resistant

2. Momentive TIG210BX Silicone Grease

  • Thermal conductivity 2.1 W/mK
  • 1-Part non-flowable, repairable silicone paste
  • Gives a thin bond line
  • Wide operating temperature range (-40°C ~ 150°C)
  • Very low bleed out & weight loss, stays in place

3. Momentive TIA0260 Silicone Adhesive

  • Thermal conductivity 2.6 W/mK
  • 1-part semi-flowable silicone paste
  • Room temperature curing (TFT 10 mins)
  • UL94 V-0
  • Good adhesive properties

4. Techsil TIM11123 GB Gap Filling Adhesive

  • Thermal Conductivity 2.3 W/mK
  • 1-part, semi-flowable silicone paste
  • 200 micron glass beads
  • Room temperature curing

5. Techsil TIM11150 Gap Filling Adhesive

  • Thermal Conductivity 2.3 W/mK
  • 1-part, semi-flowable silicone paste
  • 50 micron glass beads
  • Room temperature curing

6. Techsil 1084G Gap Filling Adhesive

  • Thermal conductivity 2.3 W/mK
  • 1-part, semi-flowable silicone paste
  • Room temperature curing (TFT 4 mins)
  • Cures to a 67 Shore A tough rubber
  • Low linear shrinkage
  • Non corrosive and solvent free

7. Momentive TIA225GF Silicone Gap Filler

  • Thermal Conductivity 2.5 W/mK
  • 2-part AC cure
  • Non flowable, dark grey paste
  • Soft stress absorbing RTV rubber

8. Momentive TIA207GN Potting Silicone Encapsulant

  • Thermal conductivity 0.7 W/mK
  • 2-part 1:1 mix, heat cure silicone
  • High temperature, UL94-V0
  • Low viscosity to conform to intricate shapes
  • Soft, elastic with tacky adhesion

9. Momentive TIA216G Soft Silicone Potting Encapsulant

  • Thermal conductivity 1.6 W/mK
  • 2-part 1:1 mix, heat cure silicone
  • Low viscosity to conform to intricate shapes
  • Soft, elastic with tacky adhesion

10. Momentive TIA222G Soft Silicone Potting Encapsulant

  • Thermal conductivity 2.2 W/mK
  • 2-part 1:1 mix, heat cure silicone
  • Low viscosity to conform to intricate shapes
  • Soft, elastic with tacky adhesion
  • UL94-V0

Visit https://www.techsil.co.uk/resource-centre/thermal-... for more information.

Contact technical@techsil.co.uk

https://www.techsil.co.uk/resource-centre/thermal-management-materials/