Thinnest bond line thickness and superior heat dissipation achieved with new heat-cure silicone from Techsil
Today's electronic devices have an increasing number of components with expanding levels of electronic complexity and heat generation. Adhesive supplier, Techsil has introduced Silcool XE13-C1862PT adhesive, to enhance the dissipation of heat generated. As a result the electronic devices are made more reliable and premature failure is prevented.
According to Andy Briars, Technical Director at Techsil, "A key design requirement of many electronic devices is high-performance heat dissipation to ensure efficient operation and protection of sensitive components. As higher operating temperatures are generated by increasingly small systems and rising circuit densities, efficient thermal management solutions are in high demand. Heat generating microprocessors are commonly mounted on ceramic or metal-core PCBs to increase thermal transfer efficiency. These PCBs are attached to a heat sink by a thermally conductive adhesive such as Momentive's Silcool XE13-C1862PT"
Silcool XE13-C1862PT is a one-component, heat curable silicone adhesive designed for applications where thermal conductivity is required. The product cures quickly with heat and adheres well to a variety of substrates without the use of a primer and has a typical thermal conductivity of 2.5 W/m.K. In addition, the product is a flowable material that can be applied in a variety of ways, eg. basic dispensing, pin-transfer and screen-printing, so it is easy work with in an industrial setting.
Compared to other competitive Thermal Interface Materials (TIM) with a similar level of thermal conductivity, Silcool XE13-C1862PT has a higher level of flexibility that can be seen in its typical elongation at break level of 80%. This property allows the Bond Line Thickness (BLT) to be reduced to a level of 50-70 microns. Its flexibility also helps compensate for mechanical movement induced by thermal cycling and Co-efficient of Thermal Expansion (CTE) differences between the heat sink and PCB materials. Furthermore, since thermal resistance is proportional to the thickness of the material through which the heat must travel, this BLT reduction results in reduced thermal resistance of the overall construction, improving the reliability and preventing premature failure of the device.
For more information visit Techsil's website and download a technical datasheet http://www.techsil.co.uk/Products/NewProducts/tabid/65/Default.aspx
