Epoxy potting compound has low viscosity and high flexibility
A two-component, flexibilised epoxy potting/encapsulation compound for high performance applications
Master Bond EP30FL is a two-component, flexibilised epoxy potting/encapsulation compound for high performance applications. EP30FL has superior electrical insulation properties and resistance to impact. It is formulated to cure at room temperatures and has exceptionally low shrinkage after cure. EP30FL has high bond strength to similar and dissimilar substrates and will resist 4K to 250°F.
Resistance to thermal cycling and shock is outstanding.
http://masterbond.com/tds/ep30fl.html
e-mail: technical@masterbond.com
