Thermal imaging for NDT and materials testing

Written by: Tom Austin-Morgan | Published:

FLIR Systems has released the X6000sc and X8000sc series thermal imaging cameras with Lock-In, Transient, and Pulse capabilities, claimed to offer unmatched capabilities to perform advanced inspections such as Non-Destructive Testing (NDT) or stress mapping that resolve temperature differences as low as 1mK.

Designed for scientists, engineers and researchers the FLIR X8000sc and X6000sc Series are said to provide high resolution thermal images up to 1280 x 1024 pixels that enable engineers to see the smallest of details accurately.

The cameras are claimed to automatically adjust their temperature range to best fit the thermal scene. It is said that the FLIR X8400sc camera can measure temperatures up to 3000°C with an accuracy of ±1°C or ±1% or faint thermal emissions from areas as small as 3 x 3µm.

The FLIR X8000sc and X6000sc Series cameras are said to work with FLIR ResearchIR Max software enabling intuitive viewing, recording and advanced processing of the thermal data provided by the camera. Each camera comes standard with this especially for R&D applications developed software.

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