Toughened, two component epoxy system withstands rigorous thermal cycling and maintains exceptionally long working life

Master Bond EP21FL is a flexibilized epoxy for high performance bonding, coating, sealing and encapsulating applications. It bonds well to a variety of substrates, including metals, glass, ceramics and many plastics. Since it is a toughened system, it is ideal for bonding dissimilar substrates with differing coefficients of expansion. These properties also enable the system to be well suited for bonding surfaces subjected to rigorous thermal cycling as well as thermal and mechanical shocks. It is a low viscosity formulation and has excellent electrical insulation properties making it highly effective for potting, particularly for larger castings. This two component epoxy cures at room temperature or more rapidly at elevated temperatures, with a forgiving four to one mix ratio by weight. EP21FL features an exceptionally long working life of 7-8 hours, along with a low exotherm while curing. It is resistant to many chemicals including water, oils, salts, etc., over the wide temperature range of -100°F to +250°F. This compound is 100% reactive and does not contain any solvents or volatiles. Master Bond EP21FL is widely used in electronic, electrical, optical and aerospace application, among others. It is available in ½ pint, pint, quart, gallon and 5 gallon containers, as well as a convenient gun dispenser. www.masterbond.com