Quartz Filled, Two Component Epoxy System for High Performance Bonding, Sealing, Coating & Casting
Featuring exceptionally high dimensional stability, Master Bond EP30QF, has very low shrinkage upon cure. This quartz filled, two component epoxy system is ideal for high performance bonding, sealing, coating and casting.
Master Bond EP30QF is especially recommended where high tensile modulus, outstanding compressive strength and superior dimensional stability are important requirements.
This quartz filled, two component epoxy is formulated for demanding bonding, sealing, coating and casting applications. It features a four to one mix ratio by weight and convenient room temperature cures in just 24-48 hours. Faster cures can be realized in just 2-3 hours at 200°F. To optimize the properties, the recommended cure schedule is overnight at room temperature, followed by 1-2 hours at 150-200°F. Linear shrinkage after cure is exceptionally low. This tan colored adhesive is 100% reactive and does not contain any solvents or other volatiles.
EP30QF produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and many solvents. Its adhesion to both similar and dissimilar materials including metals, glass, ceramics and plastics is excellent. At room temperature, this high performance system features a tensile strength greater than 7,000 psi, a compressive strength exceeding 18,000 psi and a tensile modulus over 400,000 psi.
The product's electrical properties are particularly noteworthy, making it ideal for potting and encapsulation applications. It has a dielectric strength of 420 volts/mil for a 1/8 inch thick test specimen, and a volume resistivity over 1014 ohm-cm at ambient temperatures. EP30QF is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automotive and chemical industries. A lower viscosity version called EP30QFLV is also available.