Two component epoxy

Keeping an eye toward the budget, Master Bond EP79FL has a cost-conscious silver coated/nickel filled formulation that provides outstanding electrical conductivity. With extremely low volume resistivity of less than 10-2 ohm-cm, this two component epoxy is ideal for demanding bonding and sealing applications in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries among others. EP79FL offers convenient handling with a one-to-one mix ratio, by weight or volume. The system has an open time of 60-75 minutes for a 100 gram mass and cures at room temperature in 24-48 hours or more rapidly at elevated temperatures. Once cured, this system readily develops a high bonding strength of more than 850 psi tensile shear and a T-peel of greater than 20 pli when cured and measured at 75°F. Its high flexibility and elongation are also noteworthy features. Its exceptional flexibility makes EP79FL particularly useful in bonding dissimilar substrates that are being thermally cycled and shocked. Additionally, its high flexibility combined with its inherently low shrinkage enables the cured system to exert very little mechanical stress on sensitive components and substrates. Also, the highly flexible EP79FL is easier to remove than most silver coated/nickel filled epoxies, making it well suited for repair type applications. Master Bond EP79FL has a smooth paste consistency and can be easily applied with minimal sagging on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents. However, it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent by weight such as xylene, acetone, MEK, etc, if desired. As a sealant, it resists a wide range of chemicals including water, oils and most organic solvents over the exceptionally wide temperature range of 4K to +250°F enabling it to be serviceable even in cryogenic applications. Adhesion to metals, glass, ceramics, rubbers and many plastics is excellent. Click here to read more.